Assistant/Associate Professor Advanced Packaging and Heterogeneous Integration
- Ente
- Delft University of Technology (TU Delft)
- Paese
- Paesi Bassi
- Campo di ricerca
- Engineering » Electrical engineering Engineering » Electronic engineering
- Lingua dell’annuncio
- Inglese
- Tipo di contratto
- Permanent
- Profilo ricercato
- Professore associato in ingegneria elettronica
- Sede
- Delft, Paesi Bassi
- Pubblicato il
- —
- Scadenza
- 31 agosto 2026
Descrizione
Assistant/Associate Professor Advanced Packaging and Heterogeneous Integration Sintesi in italiano (traduzione automatica): L'Università Tecnica di Delft cerca un Professore Associato in Advanced Packaging e Heterogeneous Integration per rafforzare le sue attività di ricerca nel settore dei semiconduttori. Il candidato ideale avrà un dottorato in Ingegneria Elettrica, Scienza dei Materiali, Ingegneria Meccanica, Fisica Applicata o un campo correlato, e una solida esperienza di ricerca internazionale. Le mansioni principali includono lo sviluppo di un programma di ricerca di alto livello, la supervisione di studenti di MSc e PhD, e la collaborazione con aziende leader nel settore. È richiesta una comprovata capacità di acquisire finanziamenti per la ricerca e di collaborare con l'industria. La posizione è situata a Delft, nei Paesi Bassi, in un ambiente internazionale e innovativo. Are you a leading researcher in advanced packaging and heterogeneous integration, ready to shape the future of semiconductor systems and build a world-class research program at TU Delft? Job description The Section of Electronic Components, Technology and Materials (ECTM) at Delft University of Technology invites applications for an Associate Professor position in Advanced Packaging and Heterogeneous Integration. This strategic position is created to further strengthen TU Delft’s internationally leading activities in advanced semiconductor packaging, system integration, and reliability, building on the distinguished legacy of Prof. Guoqi Zhang. You will play a key role in shaping next-generation system integration technologies that underpin future AI, high-performance computing, photonics, automotive, and sustainable electronic systems. We are seeking a candidate who can develop and lead a world-class research program, bridging fundamental science, engineering, and industrial application. You are expected to: Develop an internationally visible and externally funded research program in advanced packaging and heterogeneous integration Provide scientific leadership and contribute to the strategic direction of the ECTM section Acquire substantial competitive funding (e.g., NWO, Horizon Europe, Chips JU, industry partnerships) Build and expand collaborations with leading semiconductor companies and research institutes (e.g., ASML, IMEC, European ecosystem) Contribute to education in microelectronics, including teaching and supervision of MSc and PhD students Strengthen TU Delft’s position in Europe’s semiconductor and advanced packaging ecosystem We are particularly interested in candidates with expertise in one or more of the following areas: Advanced electronic packaging and system integration Chiplet architectures and interconnect technologies 3D integration and hybrid bonding Wafer-level and panel-level packaging Photonic-electronic co-integration Thermal management and thermo-mechanical reliability Multi-physics modeling and digital twins for electronics Power electronics and wide-bandgap packaging RF/mmWave and high-frequency packaging technologies Job requirements Essential qualifications PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Applied Physics, or a related field Strong international research track record, demonstrated through high-impact publications and/or patents Recognized expertise in advanced packaging and/or heterogeneous integration Proven ability to acquire competitive research funding Experience supervising PhD students and postdoctoral researchers Demonstrated ability to collaborate with industry Preferred qualifications Experience in emerging domains such as chiplet-based systems, AI hardware integration, co-packaged optics, or reliability-aware design Strong track record in industry collaboration or technology transfer Vision for developing future directions in semiconductor system integration TU Delft (Delft University of Technology) Working at TU Delft means contributing to solutions that really make a difference. For over 180 years, we have been training engineers who make an impact worldwide in companies, government bodies, or as entrepreneurs. Our alumni turn knowledge into concrete solutions for the challenges of today and tomorrow. These challenges are changing rapidly. That is why we focus on themes such as energy, climate, digitalisation, artificial intelligence (AI), and smart mobility every day. Our education and research are directly aligned with what society needs now and in the future. At TU Delft, our people make the difference. With their knowledge and curiosity, our staff provide a high-quality education and conduct pioneering research that extends beyond the campus. You will have the opportunity to take the initiative, work with others, and grow as a professional. Working at TU Delft means join an international community of professionals and students. Together, Annuncio in inglese. Fonte: Euraxess (Commissione europea).
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Fonte: Euraxess (Commissione europea) · Servizio indipendente
Vai al bando ufficialeLe informazioni sono aggregate automaticamente da Euraxess (Commissione europea) e possono essere incomplete. Verifica sempre i requisiti e le modalità di candidatura sul bando ufficiale.